Hogan Lovells 2024 Election Impact and Congressional Outlook Report
Hogan Lovells Events | 14 November 2023 | 3:15 p.m. - 8:00 p.m. (HKT)
We are excited to invite you to attend our half-day event on Tuesday, 14 November 2023 in our Hong Kong office. Our Financial Institutions lawyers will be hosting an informative and engaging half-day seminar involving a multijurisdictional digital bond comparison and an interactive cybersecurity training session, followed by our first client networking drinks since 2019!
Join our panel discussion on the future of Digital Bonds in APAC.
Hong Kong made something of a splash with the world's first ever government-issued tokenized green bond in February of this year: but does this pave the way for Hong Kong (or Singapore) to become a regional leader in the space? This session will take you through the current Asia regulatory framework applicable to digital bonds and explore what, if any, regulatory changes should be considered in order for this market to develop further in Asia. The discussion panel will include partners from our UK and European offices, who will share their experiences (including with respect to the DLT Pilot Regime) and lessons learned that can provide insights into the development prospects and challenges facing the Asia market, as well as representatives from our Singapore office to give a regional perspective.
Join our panel discussion on what financial institutions and service providers need to know about cybersecurity and cyber-crime prevention.
Through an interactive case study with a multijurisdictional lens covering the U.S., Hong Kong, Mainland China and Singapore, the panel will examine the key challenges that companies face before, during, and after a cybersecurity attack, including cybersecurity preparedness, incident response, notification requirements, and litigation and regulatory enforcement risk. Given the increased frequency of incidents and high risk to business, this is an area no multinational with a presence in the region can afford to ignore.